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MGR II R&D/PRODUCT DVL ENGINEERING - SI Simulation

TE Connectivity -
Bengaluru, Karnataka

Apply Now

Job details

Qualifications

Microsoft Powerpoint
Microsoft Word
Knowledge management
Microsoft Outlook
Doctoral degree
Schematics
Electronics Engineering
PCB
Microsoft Office
Master's degree
Analysis skills
Programmable logic controllers
Bachelor's degree
ANSYS
Team management
Leadership
Communication skills
Digital design

Full job description

A Printed Circuit Board (PCB) Simulation Manager is a senior engineering leader in Digital Data Networks (DDN) business in TE Connectivity, responsible for overseeing and guiding a team of engineers who simulate and analyse high speed PCB designs encompassing electrical and thermal simulations. Their primary role is to ensure that all PCB layouts meet high standards for performance, reliability, and manufacturability before prototyping and mass production at competitive cost.

Responsibilities:

Team leadership and management: Lead, mentor, and develop simulation team for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents. Manage workload, project allocation, and career growth for team members.
Simulation strategy and roadmap: Define and implement simulation methodologies and best practices for accuracy, efficiency, optimizations and recommendations across all PCB simulation projects.
Technical oversight and guidance: Provide technical direction on simulation tasks and result interpretations on signal integrity (SI) for high-speed interfaces like DDR and PCIe, power integrity (PI) for efficient power delivery, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal management.
Design review and validation: Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.
Cross-functional collaboration: Work closely with global hardware, mechanical, and manufacturing teams to translate product requirements into viable PCB designs and simulations. Communicate with cross-functional teams, customers and suppliers on simulation results and design risks.
Continuous improvement: Drive innovation and improvement in the PCB simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.
Project and resource management: Independent management of multiple complex PCB simulation projects simultaneously, ensuring projects meet deadlines, budget requirements, and performance targets.
Quality Management: lead and drive accuracy in simulations, conduct design of experiments (DoE), plausibility check and sensitivity study of simulations, cross-correlation of simulation results with experimental results, and design optimizations for first time right manufacturability (prototypes and mass production).

Candidate Desired Profile:

Education:

A bachelor’s degree in electrical or electronics engineering from a premier institute/university. A master’s degree in a related field is preferred.

Experience:

Around 15 years of extensive hands-on experience in high-speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines.
5-7 years of progressive leadership or management experience.
Breadth and depth on high performance team building, employee goal setting and performance management, talent hiring and nurturing, capability development, project acquisition, customer discussion, alignment with business objective and goals, QCD (quality, cost and delivery), strategy and execution, employee engagement, empowerment and delegation, competency and knowledge management.
Proficient and foundational knowledge on printed circuit board layout, libraries and schematics, routing and manufacturability.

Technical Skills:

Expertise with simulation tools for high-speed electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
Deep understanding of high-speed digital design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
Good understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS.
Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).

Soft Skills:

Proven abilities on inspiring leadership, team management, prioritisation, strategy and execution.
Experience in organizational development, and talent attraction/management/retention.
Promote and manage employee wellbeing and work-life balance.
Passion for Technology and scientific/engineering excellence.
Excellent problem-solving and analytical skills to resolve complex technical issues.
Strong in Technical Documentations and Report preparation.
Strong verbal and written communication skills to articulate complex technical concepts to both technical and non-technical stakeholders.
Ability to work effectively in a fast-paced, collaborative global environment and global time zones.
Proficient using MS office software (Word, Excel, PPT, Outlook, MS Teams, etc.).

What your background should look like

Generally requires Bachelors degree in appropriate field with 12 or more years of experience; or Masters degree with 10 or more years of experience; or PhD level with 6 or more years of experience; or local equivalent

Competencies

SET : Strategy, Execution, Talent (for managers)

ABOUT TE CONNECTIVITY
TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat, Instagram and X (formerly Twitter).

WHAT TE CONNECTIVITY OFFERS:
We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority!

Competitive Salary Package
Performance-Based Bonus Plans
Health and Wellness Incentives
Employee Stock Purchase Program
Community Outreach Programs / Charity Events
Employee Resource Group

IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD
TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com. If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities.

Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site.

Job Locations:

88P, Sahasra Shree
Bangalore, Karnātaka 560066
India

Posting City: Bangalore

Job Country: India

Travel Required: 10% to 25%

Requisition ID: 140969

Workplace Type: Hybrid

External Careers Page: Engineering & Technology

Apply Now

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senior software engineer ii data engineering and jobs in ka

MGR II R&D/PRODUCT DVL ENGINEERING - SI Simulation

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