TE Connectivity's Signal Integrity Center of Excellence (SI COE) drives research and development to solve critical bandwidth and high-speed interconnect challenges. The SI COE delivers validated signal integrity solutions to product teams and customers through advanced simulation, rigorous analysis, and precision measurement.
Core capabilities include detailed electrical modeling and simulation across connectors, cables, PCBs, semiconductor packages, and full systems — with a strong emphasis on model validation and correlation. The SI COE also establishes design guidelines, simulation methodologies, model quality standards, and reusable engineering workflows, while providing expert technical guidance to internal design teams and customers where signal integrity performance is paramount.
Areas of expertise span electromagnetics, microwave/RF engineering, test and measurement, integrated circuits, packaging, and system-level simulation.
