Process Engineering

Tata Electronics -
Assam

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Job details

Qualifications

Soldering
MPM
Electronics Engineering
Bachelor's degree
Kaizen
Manufacturing
Root cause analysis
Lean manufacturing
Surface mount technology

Full job description

Job ID:

38838

Date:

30 May 2026

Location:

Jagiroad, AS, IN

Department:

Assembly Technology Development

Business:

TSAT India

Role Overview:

SME - Solder Paste Printer & Reflow Soldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products.

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.

Responsibilities:

Technology & Process Setup

Manage & Optimization of SMT Production Processes of Solder Paste Printing , Inspection & Reflow.

Define and maintain all process windows, control plans & CTQ across all products of SPP , SPI & Reflow.

Setup, Operate, Programming, Optimizing SPP & Reflow Soldering machines.

Setup & Validation of Stencils, Squeegees, Solder Paste types & Printing parameters.

Develop & validate thermal profiles for new & existing PCB assemblies.

Stencil Design & Validation.

Conduct DOE & Process validation for new products and materials.

Setup , Monitor & Control critical reflow parameters

(Zone temp., Conveyor Speed, Soak time, Peak temp.)

New Model Readiness

Develop & Maintain Process documentation, WIs & SOPs (SPP, SPI & Reflow)

All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation.

Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP,SPI & Reflow (related to soldering & thermal constraints )

Ensure proper solder paste reflow per component and PCB design requirements

Ensure smooth technology transfer from development to production.

Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.

Quality Excellence

Accountable for first pass yield, final yield and field reliability.

Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis.

Monitor production yield , defect rates , cycle time and implement corrective / preventive actions.

Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints and solder balls

Partner with Quality team to address customer returns, audits and escalations.

Monitor Process parameters ( temp. Zones , conveyor speedsoak time etc )

Analyze & control print defects ( Insufficient / excess paste , smearing , bridging , skips , misalignment)

Analyze soldering defects ( tombstoning , voids , cold joints , bridging etc ) and implement corrective actions

Operational Excellence & Cost Optimization

Own cost of ownership and productivity improvement initiatives.

Drive Cycle time and line balancing improvements.

Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing )

To ensure Proper line setup , programming , Program version management ( SPP , SPI & Reflow )

To ensure compliance with ESD , Safety& IPC standards.

Analyze process data , SPC reports to identify trends & improvement opportunities.

Customer & Stakeholder Engagement

Serve as a technical team member for customers on PCBA Soldering process topics.

Will be technical team member for customer reviews, technology discussions and risk mitigation plans.

Key Deliverables & KPI

First Pass Yield

Yield and Reliability Performance

Productivity Improvement

Cost Optimization

Customer satisfaction and audit outcomes.

Education Qualifications

Bachelor in related Engineering Discipline (Preferred Electronics Engineering)

10-12 years’ hands on experience in SMT industry in a similar role ( Paste Printing , Inspection & lead free soldering processes )

Experience in high volume manufacturing environment.

Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic )

Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc )

Familiar with thermal profilers ( KIC , Datapaq , ECD etc )

Deep Understanding of solder paste behaviour & thermal profiling

Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE )

Strong knowledge on Stencil designing (Thickness , aperture , step up / down stencils )

Familiar with Lean manufacturing

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