1. Lead Electronics Design Engineer
Key Responsibilities:
End-to-end hardware lifecycle: schematic design, multi-layer PCB (4–6 layers), prototyping & DFM
Ultra-low power system design for battery-operated devices
RF design for Cellular, LoRaWAN, Wi-Fi, BLE (antenna matching, impedance control)
Industrial protection: isolation, TVS, GDT, RS-485 robustness
Compliance & testing (EMI/EMC, ESD, EFT, Surge)
Manufacturing handoff: Gerbers, BOMs, test jigs, EOL processes
2. Lead Firmware Engineer (IIoT & Edge Devices)
Key Responsibilities:
Firmware architecture for STM32 / ESP32 (RAM/Flash optimization)
Cellular communication (LTE-M/NB-IoT/4G), AT commands, TCP/IP stacks
Industrial protocols: Modbus RTU/TCP over RS-485
RTOS development (FreeRTOS / Zephyr) with multitasking & IPC
Security & OTA: secure boot, TLS, certificates, OTA updates
Code quality: MISRA standards, reviews, CI/CD pipelines
3. Lead AI Engineer — Predictive Intelligence & Autonomous Systems
Key Responsibilities:
Time-series forecasting for industrial telemetry (vibration, temperature, electrical data)
Predictive maintenance & failure detection models
AI-driven analytics for ROI insights & energy optimization
Edge AI deployment for real-time inference
Signal processing & data pipelines for industrial streams
Job Types: Full-time, Permanent, Fresher, Internship
Contract length: 11 months
Work Location: In person
