To plan, manage, and drive timely completion of projects, including new package & product derivates ramp up, FE wafer technology transfer and conversion and change projects (NLoP/NLoZD) for release package in order to ensure success in meeting project deliverable in time, scope, and budgets.
Your Role
Key responsibilities in your new role
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Responsible for the project’s success (scope, budget, time, quality, delivery)
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Responsible for driving and managing project business case
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Responsible to setup appropriate project team structure
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Define target and deliverables for the projects and all related sub-projects (if applicable)
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Continuously project risk evaluation and tracking with respect to the defined projects (package ramp up/product derivates/TCM/NLoP/Non-NLoP)
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Plan and execute mitigating measures with respect to identified/potential project risks
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Responsible for proactively manage deviation, potential concern, escalation, and changes from internal and external parties
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Prepare, control, monitor, and report project status timely with adequate documentation/reporting, of the right level of information
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Take ownership and harvest project through robust ramp up/phase-in, phase-out till project closure
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Responsible to setup documentation and production system for handover purposes
Your Profile
Qualifications and skills to help you succeed
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Degree/Master in Engineering (Mechanical, Electronic, Electrical, Material, Manufacturing) with 5 years in semiconductor industry in the field of package development, assembly engineering or project management
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Knowledge in semiconductor BE assembly / test industry
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Competency in Project Management skills and knowledge (planning, risk management, consolidation, negotiation)
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Experience in managing Class D project (medium complexity project)
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Technical know-how in FMEA, and risk analysis/assessment
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Knowledge in technical and cost interrelations/correlations, possess strong negotiation skills and strategic thinking and possess strong presentation and document compilation skills
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