Responsibilities:
We are seeking an experienced and accomplished Senior Manager – RFIC Layout to lead and drive layout development for complex RF/Analog ICs. This role requires strong technical expertise, proven leadership capabilities, and the ability to manage large teams while owning end-to-end layout delivery across product lines. The ideal candidate will play a critical role in mentoring teams, enabling advanced technology adoption, and ensuring high-quality execution in a cross-functional environment.
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Lead and manage RF/Analog layout teams, ensuring high-quality and timely delivery of design projects
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Own end-to-end layout development across product lines with strong accountability
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Mentor, train, and scale teams including freshers and contractors
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Drive floor-planning for complex RF/Analog chips and IPs considering noise and isolation constraints
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Provide technical leadership in RF signal path and high-speed design implementations
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Collaborate with cross-functional teams including ASIC, PnR, CAD, and Packaging
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Ensure compliance with Analog IP deliverables, QC processes, and release flows
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Enable team readiness for advanced technology nodes and evolving design challenges
Qualifications:
- Tech/B.E. with 20+ years of experience in RF/Analog layout.
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Experience in managing/mentoring large teams consisting of 20+ members
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Strong communication skills with proven track record of owning layout development from product lines.
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Strong Technical mentorship skills, Ability to hire/train teams train including freshers/contractors
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Should have floor-planning experience for Complex RF/Analog chips & IPs which may need magnetic coupling isolation constraints and noise isolation constraints.
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Experience in handling chipsets/top-levels in Wireless/Wi-Fi transceivers and proficiency with RF signal path building blocks such as LNA, mixers, RFPLLs, PA, Multi-GHz ADCs and DACs would be added advantage.
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Experience with High speed Serdes Designs (PAM4, PCIe, etc..) and hands on experience in building blocks of Serdes (CTLE, ADCs, DACS, PLL, High speed Clock distribution, etc.).
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Good exposure to Fin-FET technology challenges (5nm, 3nm) and should be able to ramp up the team on new technology nodes.
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Should have a good overview of the Deliverables/QC of an Analog IP into SoC context and release flows.
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Should have good cross-functional knowledge/deliverables with other teams such as ASIC, PnR, CAD and Packaging teams.
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Knowledge in ESD/IO design will be added advantage
Company Overview:
MaxLinear is a global, NASDAQ-traded company (MXL) where the entrepreneurial spirit is alive and well. We are a fabless system-on-chip product company, striving to improve the world’s communication networks for everyone through our highly integrated radio-frequency (RF), analog, digital, and mixed-signal semiconductor solutions for access and connectivity, wired and wireless infrastructure, and industrial and multi-market applications.
We hire the best people in the industry and engage them in some of the most exciting opportunities that connect the world we live in today. Our growth has come from innovative, bold approaches to solving some of the world’s most challenging communication technology problems in the most efficient and effective manner.
MaxLinear began by developing the world’s first high-performance TV tuner chip using standard CMOS process technology. Others said we couldn’t achieve the extremely high-performance requirements using CMOS, but we proved them wrong and achieved enduring global market leadership with our designs. Since then, we’ve developed a full line of products that drive 4G and 5G infrastructure; enable data center, metro and long-haul optical interconnects; bring 10Gbit to the home; power the IoT revolution; and enable robust and reliable communication in harsh industrial environments. Over the years, we’ve expanded through organic growth and through several acquisitions that have perfectly complemented our existing portfolio and enabled us to deliver complete end-to-end solutions in our target markets. One such example was the acquisition of Intel’s Home Gateway Platform Division that added Wi-Fi, Ethernet, and Broadband Gateway Processor SoC technology to our connected home portfolio creating a complete and scalable platform of connectivity and access solutions to fully address our customers’ needs.
Our headquarters are in Carlsbad, near San Diego, California. We also have major design centers in Irvine and San Jose, California; Valencia, Spain; Bangalore, India; Munich, Germany; Israel; and Singapore.
We have approximately 1,200 employees, a substantial majority of whom have engineering degrees and include masters and Ph.D. graduates from many of the premiere universities around the world. Our employees thrive on innovation, outstanding execution, outside-the-box thinking, nimbleness, and collaboration. Together, we form a high-energy business team that is focused on building the best and most innovative products on the market.
