Key Responsibilities
- Perform Signal Integrity (SI) and Power Integrity (PI) simulations for high-speed PCB designs.
- Analyze PCB layouts for impedance control, crosstalk, EMI/EMC, and timing issues.
- Conduct thermal analysis and reliability simulations for multilayer PCBs.
- Work closely with PCB Layout and Hardware Design teams to optimize board performance.
- Validate stack-up structures, transmission lines, and routing constraints.
- Perform pre-layout and post-layout simulations.
- Troubleshoot hardware issues related to high-speed interfaces and signal degradation.
- Support DFM, DFA, and manufacturing readiness activities.
- Generate simulation reports and technical documentation.
- Coordinate with fabrication and assembly teams for design validation.
Required Skills
- Strong knowledge of high-speed PCB design concepts.
- Experience in SI/PI analysis and EMI/EMC considerations.
- Knowledge of controlled impedance routing and PCB stack-up design.
- Understanding of DDR, PCIe, USB, HDMI, Ethernet, and other high-speed interfaces.
- Familiarity with transmission line theory and electromagnetic concepts.
- Good debugging and analytical skills.
Software Tools
Experience in one or more of the following tools:
- Cadence Allegro SI/PI
- HyperLynx
- ADS (Advanced Design System)
- Ansys HFSS
- CST Studio
- Altium Designer
- OrCAD
Pay: ₹10,000.00 - ₹95,000.00 per month
Work Location: In person
