Head of SMT Production (Technical Specialist)
This role requires a deep-tech SMT subject matter expert. The candidate must possess hands-on engineering experience with automated PCBA (Printed Circuit Board Assembly) lines before moving into plant leadership. You will manage the entire SMT floor, from incoming components to final automated testing.
Technical Responsibilities1. Line Optimization & Machine Programming
- Line Balancing: Optimize high-speed pick-and-place component placement sequences to maximize line throughput and balance cycle times.
- Feeder & Setup Control: Establish strict controls for feeder calibration, component trolley setup, and smart storage systems to prevent loading errors.
- Stencil & Printing Control: Define parameters for paste squeegee speed, pressure, and separation to ensure zero defects at the solder paste printing stage.
2. Thermal Management & Defect Engineering
- Thermal Profiling: Create and sign off on multi-zone reflow oven thermal profiles tailored to high-mass boards, lead-free alloys, and thermal-sensitive components.
- Inspection Data Feedback: Connect data loops from Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) to dynamically correct machine drift.
- Root Cause Diagnostics: Solve complex SMT-specific defects such as tombstoning, solder balling, head-in-pillow (HIP) effects, and voiding.
3. Equipment Architecture & Maintenance
- Capital Asset Lifecycle: Manage the calibration and preventive maintenance (PM) schedules for advanced SMT platforms (e.g., ASM/SIPLACE, Fuji, Panasonic, Mycronic).
- NPI SMT Execution: Review Gerber files and CAD data during the New Product Introduction phase to design for manufacturability (DFM) at the SMT level.
Strict Technical Requirements
- SMT Tenure: Minimum 10 + years of direct SMT/PCBA manufacturing experience , starting as an SMT Process or Maintenance Engineer.
- Component Mastery: Expert handling of ultra-fine-pitch components, including 01005 chips, micro-BGAs, LGAs, and package-on-package (PoP) technology.
- Industry Standards: Mandatory active or past certification in IPC-A-610 (Acceptability of Electronic Assemblies) and IPC-7525 (Stencil Design Guidelines).
- Process Tools: Mastery of SMT-specific software (e.g., Valor, Panasonic PanaCIM, Fuji Nexim ) and stencil inspection tools.
