We are looking for an experienced PCB Designer to join our hardware engineering team. The ideal candidate will have hands-on expertise in Cadence Allegro and a strong track record of designing complex, high-speed multilayer boards involving DDR4 memory interfaces, microprocessors (MPU), and microcontrollers (MCU). You will work closely with hardware, signal integrity, and mechanical teams to deliver manufacturable, high-quality board designs.
Key Responsibilities:
- Design multilayer PCB layouts (8+ layers) for embedded systems built around MPU and MCU platforms using Cadence Allegro.
- Perform placement and routing of high-speed interfaces, with particular focus on DDR4 memory topologies (fly-by routing, length matching, byte-lane grouping, timing/skew constraints).
- Define and manage constraint sets in Allegro Constraint Manager (impedance, differential pairs, min/max lengths, relative propagation delay).
- Develop stack-up definitions in collaboration with fabrication vendors, ensuring controlled impedance and signal integrity requirements are met.
- Work with hardware engineers on component placement, power delivery network (PDN) design, and decoupling strategies for high pin-count BGAs.
- Implement design-for-manufacturing (DFM), design-for-assembly (DFA), and designfor-test (DFT) guidelines.
- Perform BGA fanout and via optimization (via-in-pad, microvias, blind/buried vias as needed for HDI designs).
- Coordinate with SI/PI engineers and incorporate simulation feedback into layout.
- Generate and verify manufacturing outputs: Gerbers/ODB++, drill files, fab andassembly drawings, pick-and-place files, and BOM support.
- Participate in design reviews and maintain layout documentation and library components (footprints, padstacks) per IPC standards.
Required Skills & Qualifications:
- 3–5 years of hands-on PCB layout experience.
- Strong proficiency in Cadence Allegro PCB Editor (including Constraint Manager); experience with OrCAD/Allegro schematic flow is a plus.
- Proven experience routing DDR4 memory interfaces, including length/skew matching, topology selection, and termination strategies.
- Experience laying out boards based on MPUs (e.g., NXP i.MX, TI Sitara, ST MPU families) and MCUs (e.g., STM32, NXP, Renesas, Microchip).
- Solid understanding of high-speed design principles: impedance control, crosstalk, return paths, EMI/EMC considerations.
- Familiarity with fine-pitch BGA fanout, HDI technology, and multilayer stack-up design.
- Knowledge of IPC standards (IPC-2221, IPC-7351, IPC-A-600).
- Ability to read and interpret schematics, datasheets, and layout guidelines from silicon vendors.
- Good communication skills and ability to work cross-functionally with hardware, mechanical, and manufacturing teams.
Preferred / Nice-to-Have:
- Exposure to SI/PI simulation tools (e.g., Sigrity, HyperLynx).
- Experience with other high-speed interfaces: PCIe, USB 3.x, Gigabit Ethernet, LVDS, MIPI.
- Familiarity with flex/rigid-flex design.
- Experience working directly with PCB fabrication and assembly houses.
- Bachelor’s degree/Diploma in Electronics, Electrical Engineering, or related field.
What We Offer:
- Opportunity to work on cutting-edge embedded hardware products.
- Collaborative environment with experienced hardware and SI engineers.
- Competitive salary and benefits. Professional growth and training opportunities.
Benefits:
- Health insurance
- Internet reimbursement
- Provident Fund
Work Location: In person
