Designs, develops and validates new electronics packaging solutions
Possesses and applies a working knowledge of compliance requirements to designs including MIL-STD, UL, EN, CSA , CE and EV (AIS-138) charging standards
Perform detailed component-level analysis to identify locations and operating conditions of high electromagnetic / thermal / mechanical stresses
Survey and investigate advanced circuit topologies component/ board / packaging / manufacturing technologies to further improve circuit performance, fault-tolerance, and to reduce overall cost, weight, sizes
Develop mixed-mode circuits for power electronics applications, to achieve high accuracy, robustness, and low power consumption
Consolidate the discrete components to hybrid ICs to improve robustness and collaboration with manufacturing engineers and suppliers to transition concepts to production functionality, to reduce cost, size, and weight
Integrate the power modules, cooling, gate drives, discrete component, and sensors in one package for better overall layout, robustness, easier manufacturing, and at a lower overall cost
Generate BOM from conceptual design
Plan, direct and completes product/part testing and validation
Benchmark competitive solutions
Understand customer technical needs. Resolves customer complaints
Solve manufacturing issues (assembly, machining, etc.), quality issues (dimensional, material, and design discrepancies, etc.), and purchasing issues (vendor qualification, engineering support, etc).
Manages product line cost reduction initiatives and reliability improvement initiatives.
