Golnaka Hyderabad Telangana Senior lead engineer physical design Jobs – 154 Open Jobs Today

Senior / Lead Physical Design Engineer
Axiado —Hyderabad, Telangana
- Full-time
- B.Sc
- Master's degree
- Bachelor's degree
Quick apply
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- English
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- Full-time
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- Full-time
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Advanced Micro Devices, Inc —Hyderabad, Telangana
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Advanced Micro Devices, Inc —Hyderabad, Telangana
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- Full-time
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Hubbell Incorporated —Hyderabad, Telangana
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SkySpecs —Hyderabad, Telangana
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19h

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Senior / Lead Physical Design Engineer

Axiado -
Hyderabad, Telangana

Quick apply

Job details

Full-time

Qualifications

B.Sc
Information security
Master's degree
Bachelor's degree
Mentoring
Scripting
Electrical Engineering
Python
Debugging

Full job description

Company Description

Axiado is building the future of AI powered digital infrastructure. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management. Our technology protects the world’s most critical infrastructure—from data centers to next generation cloud and AI platforms—by securing systems at the foundation levels of hardware, independent of host CPUs and operating systems.

Founded in 2019 and now over 150 employees are strong, Axiado has evolved into a recognized leader in the convergence of AI, security, and silicon innovation. We partner with and are actively engaged in commercial programs with multiple Tier 1 industry leaders, validating both our technology and our long-term market trajectory. Axiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Company’s 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliance’s 2025 “Start-Up to Watch” award.

At Axiado, developing breakthrough technology takes more than great engineering—it takes a team of exceptional people who collaborate boldly, challenge assumptions, and take pride in building what comes next. We value curiosity, execution, respect, and a shared desire to make a meaningful impact on the security and reliability of the digital world.

If you’re driven to innovate, energized by hard problems, and excited to help define the future of secure AI infrastructure, we invite you to apply and join us on this journey.

Job Description

We are looking for a highly experienced and hands-on Senior / Lead Physical Design Engineer to drive backend implementation, signoff quality, methodology development, and project execution across our ASIC programs.

This role combines technical leadership with hands-on execution. The successful candidate will be responsible for defining implementation strategies, establishing Physical Design and Physical Verification methodologies, reviewing and guiding work performed by contractors and external vendors, and ensuring successful execution from RTL handoff through tapeout.

The ideal candidate is a strong shift-left thinker who can proactively identify implementation risks, influence architectural decisions, and drive scalable solutions while remaining deeply involved in technical problem solving.

Key Responsibilities

Technical Leadership & Project Execution

Lead Physical Design activities from project planning through tapeout.
Define implementation strategies, milestones, and execution plans.
Work closely with contractors, consultants, and external implementation partners to ensure high-quality deliverables.
Review implementation progress, identify risks, and drive corrective actions.
Provide technical leadership across Physical Design, STA, DFT, RTL, and CAD teams.
Drive design reviews and implementation readiness reviews.

Physical Design Ownership

Own block and full-chip implementation activities including:
Floorplanning
Power Planning
Placement
CTS
Routing
Timing Closure
ECO Implementation
Signoff Closure
Drive performance, power, area, congestion, and timing optimization.

Physical Verification & Signoff

Define and drive signoff methodology and closure strategy.
Lead DRC, LVS, ERC, Antenna, Density, and Manufacturing rule closure.
Review and sign off vendor deliverables related to physical verification.
Debug complex signoff issues and drive root-cause resolution.

Methodology & Flow Development

Develop and improve Physical Design methodologies, implementation recipes, and signoff flows.
Drive automation initiatives to improve productivity and design quality.
Establish best practices, checklists, and execution guidelines across projects.
Promote shift-left methodologies to improve backend predictability and reduce project risk.

Cross-Functional Collaboration

Partner with Architecture, RTL, DFT, Verification, Packaging, CAD, and Product teams.
Influence design decisions through implementation-aware feedback.
Drive early risk identification and mitigation planning.
Support customer, vendor, and management reviews when required.

Qualifications

Required Qualifications

BS/MS in Electrical Engineering or related field.
8–12 years of ASIC Physical Design experience.
Multiple successful tapeouts in advanced technology nodes.
Strong experience owning implementation from RTL handoff through GDS signoff.
Experience leading projects, reviewing deliverables, and coordinating work across multiple stakeholders.

Strong Expertise In

Floorplanning & Hierarchical Planning
Power Planning
Placement & Optimization
CTS & Clock Architecture
Routing & Signal Integrity
STA & Timing Closure
ECO Methodologies
MCMM Flows
Power Optimization
Low Power Design Techniques

Physical Verification Expertise (Must Have)

Strong hands-on experience with:
Calibre
IC Validator (ICV)
Expertise in:
DRC
LVS
ERC
Antenna
Density Closure
Physical Signoff
Ability to independently debug and resolve complex signoff issues.

Preferred Qualifications

Experience managing or mentoring junior engineers, contractors, or external vendors.
Strong Tcl and Python scripting skills.
Experience developing implementation methodologies and signoff frameworks.
Experience with advanced nodes (7nm/5nm/3nm and below).
Familiarity with low-power implementation and UPF flows.
Experience with package-aware floorplanning and bump planning.

Additional Information

All your information will be kept confidential according to EEO guidelines.

Quick apply

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