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Senior Project / Lead Engineer

e-con Systems -
Chennai, Tamil Nadu

Apply Now

Job details

Qualifications

Schematics
FPGA
Electronics Engineering
PCB
Electrical experience
Bachelor's degree
Embedded software
Electrical Engineering
Communication skills
Digital design

Full job description

JOB ID: e-con004

Job Synopsis:

Geography: India - 3nos

Location: Chennai

Experience: 3+ Years

Educational Qualification : Bachelor's degree - EEE/ ECE

Role Overview:

We are seeking a skilled and motivated Hardware Design Engineer with hands-on experience in high-speed digital design and protocols (such as MIPI, USB 3.x, PCIe, Ethernet, or HDMI). The ideal candidate will contribute to the design, development, and validation of high-performance hardware systems with a strong emphasis on signal integrity, layout design, and compliance to protocol standards.

Key responsibilities:

To architect, design and develop embedded hardware for Camera Based Application by means of the following:

Requirement gathering based on discussion with customer or Lead
Selection of suitable components for the above requirements
Design analysis
Schematics design, optimized BOM generation
Interact with the PCB Team and get the layout completed with the following items followed
- Standard guidelines for best EMI/EMC performance
- Standard DFM guidelines
Testing, bring up and Design validation
Completion of doing EMI/EMC pre-compliance testing at standard laboratories
Handover to production team for mass production
Laying out production test plan considering the test jig feasibilities and with the help of a software resource
Supporting production team for production issues.

Key Technical Skills Required:

Strong electrical/electronic basics (Good in fundamentals like transistors, resistors, inductors, capacitors, op-amps)
Should have worked in DC - DC power design (LDO, Buck Converter, Boost converter, Buck-Boost, PMIC etc)
Knowledge in High-Speed design (Single ended and differential signals)
Low speed interfaces – USB2.0, UART, SPI, I2C, PM BUS, SM BUS etc
High Speed Interface – PCIe, Ethernet (MII, RMII, RGMII, SGMII), USB3.0, Parallel Interface knowledge
Should have worked with Microcontrollers / Microprocessor / FPGA/ DSP etc
Design skills – DC Analysis, AC Analysis, Thermal analysis, Load analysis, Timing analysis
Tools used: Cadence OrCAD for schematics, Allegro/Altium experience for PCB board Design review, Gerber Viewers.
Knowledge in PCB layer stack-up, PCB routing, Signal integrity, Power Integrity, thermal simulation, environmental tests, FCC, and EMI/EMC (EFT, ESD, CS, CE, RE, RS) compliance testing.

Preferred Attributes:

Exposure to camera or video-based products (e.g., camera interface via MIPI CSI).
Knowledge of thermal and power management in hardware design.
Excellent analytical, communication, and documentation skills.
Team player with a proactive and solution-oriented mindset.

Apply Now

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I want to receive the latest job alerts for production dsp

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JOB ID: e-con004

Job Synopsis:

Role Overview:

Key responsibilities:

To architect, design and develop embedded hardware for Camera Based Application by means of the following:

Key Technical Skills Required:

Preferred Attributes:

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