Telangana Packaging engineer Jobs – 100 Open Jobs Today

Phy- V Lead
Advanced Micro Devices, Inc —Hyderabad, Telangana
- Master's degree
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Phy- V Lead

Advanced Micro Devices, Inc -
Hyderabad, Telangana

Apply Now

Job details

Qualifications

Master's degree
SoC
Electrical experience
Bachelor's degree
Macros
Electrical Engineering
Python

Full job description

Overview:

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.

Responsibilities:

THE ROLE

As a PHY‑V Lead, you will own physical verification sign-off, full-chip integration, and packaging interface (RDL) planning for advanced SoC programs. You will drive DRC/LVS clean tapeouts, integration quality, and sign-off predictability across complex multi-IP designs.

This role requires strong expertise in physical verification, top-level integration, and advanced packaging alignment, along with the ability to lead cross-functional execution across PD, Analog, and Packaging teams.

THE PERSON

Strong technical leader with deep PD + Physical Verification understanding
Proven ownership of sign-off closure for complex SoCs
Ability to drive execution across multiple teams and dependencies
Detail-oriented with focus on quality, manufacturability, and schedule predictability
Comfortable operating in high-pressure tapeout environments

KEY RESPONSIBILITIES

✅ Physical Verification & Sign-off Ownership

Drive end-to-end DRC, LVS, ERC, antenna closure at block and full-chip level
Define and enforce sign-off methodology and quality criteria
Own foundry rule decks, waivers, and risk assessments
Deliver sign-off clean GDS for tapeout

✅ SoC / Full-Chip Integration

Lead top-level integration of IPs/macros into SoC
Own:
- GDS assembly
- Hierarchical LVS reconciliation
Resolve:
- Boundary issues
- Connectivity mismatches
- Integration conflicts
Ensure robust integration across internal and third-party IPs

✅ RDL & Packaging Integration

Drive RDL planning and bump mapping strategy
Define IO escape routing and die–package interface
Collaborate with Packaging, SI/PI, and system teams
Enable flip-chip / 2.5D / 3D integration readiness

✅ Tapeout Execution & Tracking

Own sign-off checklist, closure tracking, and tapeout readiness
Lead tapeout reviews and milestone tracking
Drive cross-team closure to meet schedule and quality targets

✅ Methodology & Flow Development

Define and improve physical verification flows (Calibre/ICV/Pegasus)
Drive:
- Automation (TCL/Python)
- Runtime optimization
- Debug efficiency
Establish best practices for hierarchical and incremental sign-off

✅ Debug & Issue Resolution

Lead debug of:
- Complex DRC violations
- LVS mismatches (shorts/opens/connectivity issues)
Drive closure with PD/layout teams
Minimize waivers and ensure risk-managed sign-off

✅ Leadership & Collaboration

Lead and mentor PHY‑V engineers
Act as primary escalation point for sign-off issues
Interface with:
- PD / PnR teams
- Analog/layout teams
- Packaging and foundry teams

REQUIRED QUALIFICATIONS

B.Tech / M.Tech in Electronics / Electrical Engineering
10–15+ years in Physical Design / Physical Verification / SoC Integration
Strong expertise in:
- DRC, LVS, ERC, antenna checks
- Tools: Calibre / ICV / Pegasus
Solid understanding of:
- sign-off)
- Advanced process nodes (7nm and below)

PREFERRED QUALIFICATIONS

Experience in:
- Full-chip SoC integration and GDS assembly
- RDL planning and advanced packaging flows
Exposure to:
- IR/EM, SI/PI, PEX, reliability checks
- Chiplet / 2.5D / 3D-IC methodologies
Strong scripting (TCL/Python) for automation

#LI-BM2

Qualifications:

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

Apply Now

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